Thermal-Mechanical Analysis and Optimum Design of Chip-on-Glass and Flex-on-Glass Packaging
碩士 === 逢甲大學 === 航太與系統工程所 === 97 === The adhesive-based FC technology are now widely used for drive IC packaging in LCD panel, including the anisotropic conductive film/adhesive(ACF/A) or the non-conductive film/adhesive(NCF/A) types of the chip-on-glass (COG) and chip-on-flex (COF) technologies. As...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/63621038395257219962 |