Stress and deformation analysis of constructed components in theprocess of thermo-compression bonding for the Flip-Chip packaging
碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 97 === This thesis analyses the stress of IC chip bumps under pressure and heat loading during the thermo-compression bonding in the process of Chip On Glass (COG). The bumps stress and distributions will directly influence to the deformation of conducting partic...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/72627059247633553965 |