An AOI Approach for IC Lead Verification
碩士 === 國立交通大學 === 工業工程與管理系所 === 97 === To wire-bond automatically, the bonding lead position from CAD model and the corresponding lead position of actual base material should be pre-given. In the manufacturing process, base material is produced based on CAD-model. However, due to production techniqu...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/96733460736790547106 |