The study of Electromigration on Lead-free SnAgBiIn Solder with Cu Electrodes
碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 97 === Pb-free SnAgBiIn solder lines were prepared in Si(001) U-grooves to investigate the behaviors under electromigration. Cu electrodes were electroplated in the grooves and the solders were consequently reflowed between the electrodes. The samples were tested u...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/et3e5b |