Interfacial Reaction between Sn and Cu-xZn Substrate after Reflow and Thermal Aging
碩士 === 國立清華大學 === 材料科學工程學系 === 97 === Zn addition to Cu under bump metallurgy (UBM) in the solder joint was the subject of this study. An alternative design was carried out to fabricate pure Sn as the solder and Cu-xZn (x=15 and 30 wt.%) as the UBM to form the reaction couple. As Zn increased from 1...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54190998200776061553 |