The Study of Adhesion Between Solder Mask and Copper Surface of Ball Grid Array Substrate
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 97 === This research focuses on the micro-etching process of the copper surface of BGA Substrate to enhance the adhesion between Solder Mask and the processed copper surface. The experiment panels under various etching amount were obtained by changing the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93x9hc |