Electromigration Study of Ni-Pd-Au UBM effect
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩 === 97 === In this thesis ,our purpose is utilizing the different thickness of UBM ,connect the circuit and compare the electromigration phenomenon for solder ball with UBM and aim different thickness with the same time to probe into their characteristic ,and...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/ghjk3r |