| Summary: | 碩士 === 華梵大學 === 機電工程學系博碩專班 === 98 === The aimed of this paper is to study the laser melting and cutting technique with the water cooling-assistance for brittle substrates. The laser used was CO2 Laser and the experimental materials were LCD glass substrates. The substrates were submerged 1 mm beneath the water surface. The method can reduce the generation of the defects in the cutting process relative to that of the conventional laser melting cutting in air. The quality of laser cutting for the laser parameters of power, frequency, and cutting speed was studied. It can be found that the underwater laser melting and cutting could improve the phenomena created by non-water auxiliary technique, such as: micro-cracks, molten slag, and cracks-linkage. Also in this study, the array-holes cutting by trepanning were conducted and analyzed. The minimum distance between the two neighbor holes that can be obtained was not greater than 1 mm. The SEM photographs of the cutting surface were obtained to analyze the cutting quality. Finally, the finite element software ANSYS was employed to calculate the temperature and stress distributions for the cases of laser cutting in air and underwater. The phenomena of the melting and breaking were also explained from the results of stress analysis.
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