EMC Adhesion Effects of Sandblasted and Electrical-Discharge-Machined Surface on IC Encapsulation Mold
碩士 === 國立成功大學 === 工程科學系碩博士班 === 98 === In IC packaging, when epoxy molding compound (EMC) is filled in the cavity and cures in the mold, adhesion effects occur in the interface between EMC and mold surface, which may influence the ejection process of the molding. Excessive adhesion effects would ca...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/92376237487343879460 |