Experiment and analysis of chemical mechanical polishing(CMP) of sapphire wafer
碩士 === 國立臺灣科技大學 === 機械工程系 === 98 === The study mainly explores the processing mechanism of a hard and brittle material, sapphire wafer substrate by chemical mechanical polishing (CMP). A polishing fluid containing SiO2 is used to contact with substrate to produce chemical reaction for removal of sa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62006275480949672724 |