Effects of Thermal and Moisture Loadings on Interfacial Stresses of Electronic Package
碩士 === 雲林科技大學 === 機械工程系碩士班 === 98 === Both the linear and sequential processing model are construed to simulate the package warpage and stresses under thermal and moisture loadings during the test process. The test conditions of package are based on three JEDEC test standards. The simulated package...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/25620451064547586897 |