Design and research of the bandwidth enhanced circuits for wire bonding in integrated circuit packaging
碩士 === 華梵大學 === 電子工程學系碩士班 === 99 === In recent years, due to the development of communications systems and tend to make high-frequency circuit applications, as well as integrated circuit packaging technology matures. the signal transmission through the package wire bonding, the signal bandwidth has...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06444502220658126633 |