Preparation and Diffusion Barrier Property of Ultrathin AlCrTaTiZrRu Senary-Alloy Nitride Film Stacks
碩士 === 國立中興大學 === 材料科學與工程學系所 === 99 === As the line width and spacing of Ultra-Large Scale Integrated (ULSI) circuits continually decrease, copper has been widely used as an interconnect material because of its low electrical resistivity and high electromigration resistance. To retard rapid copper d...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/38266962794285266096 |