Analysis of the Optimal Distribution of Shorting Vias in Multi-Layer Printed Circuit Board
碩士 === 國立中山大學 === 電機工程學系研究所 === 99 === In modern high-speed digital circuits, the space of the traditional single-layered or double-layered circuit board is not enough, therefore multi-layered circuit and stacked distribution technology are widely applied to many applications. The signal via is a ve...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/86767639637544026765 |