Development of an Electrical Assisted Chemical Mechanical Polishing (EACMP) for Cu Film Planarization
碩士 === 國立臺灣科技大學 === 機械工程系 === 99 === Chemical mechanical planarization/polishing (CMP) has become an attractive technology in IC manufacturing process because it can achieve the requirement of high material removal rate (MRR) and global planarization. As the feature size decreases and the rapid deve...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7q9p8u |