Parameters Optimized of Harmonic UV 355 Laser Cutting
碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 101 === Laser cutting processes serve extensively on several metals and compound materials. They can be wielded in general machining process especially on Al2O3 ceramic substrates. Al2O3 substrate is a proper material of Multilayer ceramic capacitors (MLCC, CMC)....
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Online Access: | http://ndltd.ncl.edu.tw/handle/qed846 |