Study on Selecting Package Material and Thermal Management for High Power LED Lamps

碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 100 === Due to the improvement of luminous efficiency, LED has been applied in general lighting nowadays. However, the efficacy and life of high power LED lamps are degraded for the problem of overheat temperature of the chips. In accordance with the above reason,...

Full description

Bibliographic Details
Main Authors: Han-Cheng Zou, 鄒漢澄
Other Authors: Shyue-Jian Wu
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/44921667499489841352