Warpage Improvement of Underfill Materials for Flip-chip Packaging
碩士 === 中原大學 === 機械工程研究所 === 101 === In the semi-conductor assembly technology industries, following process of the technology, the development trends of different electric equipment products move towards the light, thin, short, small, and multi-functional merger direction. At present semiconductor e...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/58756365990243633371 |