Research of the Low Temperature Die Bonding Process for LED

碩士 === 明新科技大學 === 精密機電工程研究所 === 101 === High power LED has become the mainstream of the illumination industry, and the thermal performance has become the key technology. Owing to the poorness of thermal performance and reliability, the silver epoxy process, the most common process of LED die bond...

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Bibliographic Details
Main Authors: Tsung-Han Yang, 楊宗翰
Other Authors: Hsing-Hsin Huang
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/26750423170552640845