Application of Six Sigma project approach to improving the quality of on solder ball placement process of the semiconductor assembly
碩士 === 國立勤益科技大學 === 工業工程與管理系 === 101 === This research is based on the process of solder ball placement as an experiment, compositing " 6X sigma DMAIC ", " mind map " for searching the key factor and applying through " Taguchi method " to obtain the correct process par...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/05206215929894376496 |