Effects of Diamond Disk Dressed Characteristics on the Micro-Scratch Defect of CMP process

碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 101 === With the vigorous development of the integrated circuit electronic components, in order to effectively increase productivity and reduce costs, the aspect ratio in the semiconductor manufacturing process is raised and the chip design become laminated and...

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Bibliographic Details
Main Authors: Chin-Huang Tsai, 蔡進晃
Other Authors: Ren-Haw Chen
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/61383894548848141333