Investigation of Mold flow Analysis , Shrinkage and Residual Stresses in Post Cure of FBGA Packages
碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 101 === To isolate the IC circuit and environment, to protect it from dust, and to provide enough strength to protect chip, we are developing the manufacture of the wire and lead frame in the IC packaging process. In this process, defects may arise, such as short sho...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/69923995808439672220 |