Optimal Design Parameters of Step Micro-channel Heat Sink by Using Taguchi Method

碩士 === 中原大學 === 機械工程研究所 === 102 === The developing of technology is improved day by day, wherefore the process and machines will be more accurate and precise, and the more the inner heat flux generated, the higher required efficiency for cooling. The micro-channel is the one of the high efficient co...

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Bibliographic Details
Main Authors: Hsiang-Kai Huang, 黃翔楷
Other Authors: Cheng-Hsing Hsu
Format: Others
Language:zh-TW
Published: 2014
Online Access:http://ndltd.ncl.edu.tw/handle/97308638753705974475
Description
Summary:碩士 === 中原大學 === 機械工程研究所 === 102 === The developing of technology is improved day by day, wherefore the process and machines will be more accurate and precise, and the more the inner heat flux generated, the higher required efficiency for cooling. The micro-channel is the one of the high efficient cooling technologies with small size. In this case, the software ANSYS Fluent and Taguchi method are used to simulates and analyze the micro-channel heat sink model to find out the minimum pressure drop and the minimum thermal resistance, and discussions are made for the few factors of pressure drop and thermal resistance such as the shape of channel, the height of channel inlet (H_c), the width of channel inlet (W_c), the thickness of basic (δ_b), the height of stage (H_0) and Pitch(L_0). Considering the cases of the pressure drop, we obtain an optimal factor combination was A1-B3-C2-D1-E3-F1, and it means the minimum pressure drop is 6.251kPa. Comparing with the pressure drop of original design (6.688kPa), the reduction in pressure drop is 6.5 percent. And the most dominant factor contributing to the pressure drop is the width of micro-channel inlet (factor C), with the height of channel inlet (factor B) being the next. For the cases of the thermal resistance, the obtained result was A2-B1-C1-D3-E1-F3, and it said that the minimum thermal resistance was 1.4×〖10〗^(-5) K〖 m〗^2 W^(-1). Comparing with the thermal resistance of original design (1.43×〖10〗^(-5) K〖 m〗^2 W^(-1)), it reduces 0.09 percentages. And the priority of factors with the thermal resistance is the width of micro-channel inlet (factor C), then Pitch (factor F).