Improvement of Reliability Issues of Microelectronic Packaging by Controlling the Orientation and Morphology of Cu-Sn Intermetallic Compounds
博士 === 國立交通大學 === 材料科學與工程學系所 === 102 === This dissertation contains two parts. In the first part, we control the formation of η-Cu6Sn5 by adopting <111> oriented and nanotwinned copper pads. In 3D IC packaging, there are tens of thousands of microbumps in one single chip. Therefore, how to...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93941192238464457379 |