Surface Mount Technology-Optimization Process Condition of Flip Chip Soldering on Flexible Printed Circuit Board

• Main Authors: Ko Kuo Hsiang, 柯國祥
• Other Authors: 卜一宇
• Format: Others
• Language: zh-TW
• Published: 2014
• Online Access: http://ndltd.ncl.edu.tw/handle/nf353w

碩士 === 國立高雄海洋科技大學 === 微電子工程研究所 === 102 === Recently, the electronic products are changing constantly, in response to consumer demand, related electronic products are toward miniaturization development, the assembly technology also refined, especially key is on Surface Mount Technology (SMT) . This study will focus on the current Surface Mount Device (SMD), place the chip on the Flexible Print Circuit (FPC), pass through reflow, using thermal react let the chip soldering on the FPC. Research the different dose of flux on chip solder ball (1/3、2/3、3/3 bump), the slope of pre-heat in the reflow (3、4、5、6℃/sec), find out the best process condition is flux dipping 2/3 bump and reflow pre-heat 4℃/sec in this experiment, then as a follow-related process improvement and enhance the way.