The Strain Rate Effect on Reliability Assessment of Electronic Packaging

碩士 === 國立清華大學 === 動力機械工程學系 === 102

Bibliographic Details
Main Author:	林思妘
Other Authors:	江國寧
Format:	Others
Language:	zh-TW
Published:	2014
Online Access:	http://ndltd.ncl.edu.tw/handle/52306551538618062538

id	ndltd-TW-102NTHU5311032
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spelling	ndltd-TW-102NTHU53110322016-03-09T04:31:08Z http://ndltd.ncl.edu.tw/handle/52306551538618062538 The Strain Rate Effect on Reliability Assessment of Electronic Packaging 應變率對封裝可靠度影響評估林思妘碩士國立清華大學動力機械工程學系 102 江國寧 2014 學位論文 ; thesis 75 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立清華大學 === 動力機械工程學系 === 102
author2	江國寧
author_facet	江國寧林思妘
author	林思妘
spellingShingle	林思妘 The Strain Rate Effect on Reliability Assessment of Electronic Packaging
author_sort	林思妘
title	The Strain Rate Effect on Reliability Assessment of Electronic Packaging
title_short	The Strain Rate Effect on Reliability Assessment of Electronic Packaging
title_full	The Strain Rate Effect on Reliability Assessment of Electronic Packaging
title_fullStr	The Strain Rate Effect on Reliability Assessment of Electronic Packaging
title_full_unstemmed	The Strain Rate Effect on Reliability Assessment of Electronic Packaging
title_sort	strain rate effect on reliability assessment of electronic packaging
publishDate	2014
url	http://ndltd.ncl.edu.tw/handle/52306551538618062538
work_keys_str_mv	AT línsīyún thestrainrateeffectonreliabilityassessmentofelectronicpackaging AT línsīyún yīngbiànlǜduìfēngzhuāngkěkàodùyǐngxiǎngpínggū AT línsīyún strainrateeffectonreliabilityassessmentofelectronicpackaging
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The Strain Rate Effect on Reliability Assessment of Electronic Packaging

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