Effect of package materials on warpage of IC package

• Main Authors: Wang, Wen-Ting, 王玟婷
• Other Authors: Tsai, Jia-Lin
• Format: Others
• Language: zh-TW
• Published: 2015
• Online Access: http://ndltd.ncl.edu.tw/handle/49y5em

碩士 === 國立交通大學 === 機械工程系所 === 103 === This research investigated the effects of IC package materials on the package warpage after fabrication using finite element analysis. Two kinds of overmold and four kinds of underfill were taken into account and results indicated that higher coefficient of thermal expansion (CTE) of substrate would faciliate the convex deformation of package warpage. From the eight groups of IC packages, two IC packages contraining the substrates with significant differences in thickness and CTE were selected and then optimized in the study. The IC package materials considered in the optimization were underfill and overmold, which were optimized using response surface method and Taguchi method. Comparing the results obtained from the two methods indicated that, the response surface method is better than the Taguchi method, but the computational cost in the response surface method is relatively high. In addition, within the ranges of the materials considered in the study, it was revealed that higher CTE of underfill or the higher Young’s modulus of underfill would result in the convex deformation of warpage. On the other hand, higher Young’s modulus of overmold or higher CTE of overmold might yield the concave deformation of warpage.