TSV and Bonding Technology Application on Flip Chip LED
碩士 === 國立臺南大學 === 電機工程學系碩博士班 === 103 === In this study, A new process of electroplate Sn-Ag bumping on a Si chip for 3-dimensional packaging was investigated. The electroplating characteristics of the Sn-Ag electrolyte and the bump growth were examined. The substrate was a Si die with a thickness of...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/64639588459742885137 |