Step Coverage Study of Through Silicon Via in Sputter Process
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 103 === This thesis studied the step coverage performance of titanium-copper (Ti-Cu) in silicon wafer with different via width and depth in sputter process. The film uniformities in the deposition of Ti and Cu respectively with different platen power an...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2015
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| Online Access: | http://ndltd.ncl.edu.tw/handle/39289694403950281787 |