A thermal management of a high output wattage power supply

• Main Authors: Ming-Tang Yang, 楊茗棠
• Other Authors: Shuo-Jen Lee
• Format: Others
• Language: zh-TW
• Online Access: http://ndltd.ncl.edu.tw/handle/01744388594264231489

碩士 === 元智大學 === 機械工程學系 === 103 === This study is to optimize a thermal management of a high output wattage power supply equipment. The systematic method helps improve the thermal status for the critical components. The analytical factors built up the guidelines which could be the design concepts in the near future. There are three major experimental steps in this thesis. First, it is to apply three pre-screen simulations. The two fans was being placed at three locations which are air-intake section，middle section and air-outtake section. The best fans locations was related base on the temperature comparison of the critical components. Next, we conduct a series of pre-screen simulations to decide the suitable material for all of the heat sinks. The material of the heat sinks were chosen by the temperatures of semiconductors adhered on the heat sink itself, the raw material costs of aluminum and copper was considered as well. Finally, the parameters of the pre-screen factors were decided to establish Taguchi method. The optimized design would be extracted from the 18 simulations. The factors are case opening，the thicknesses of the heat sinks, amounts and thickness of the extruded fins and the pitches of the semiconductors. The analysis verified that the copper and aluminum material has equal thermal cooling effect if the impedance of air flow is low. The thermal efficiencies of 2 mm and 5 mm thickness heat sink are very close. Those components which are sensitive to heat should be close the air intake. Finally, the pitches of the semiconductors can be neglected when force-convention the high air flow conditions. The design methodology combine Taguchi experimented design and Flotherm CAE simulation which proof to be a usual tool for high output wattage supply.