| Summary: | 博士 === 崑山科技大學 === 機械與能源工程研究所 === 104 === The electrical technology has been fast developed over the past few decades. Moreover, the tendency of micro elements and dense division multiplex is significantly. Hence, the high heat dissipative and electrical insulating device will be popular and attractive to the industry.
It is well known that AlN is chemically stable under high temperature. This is quite attractive to the electrical engineering. Furthermore, the heat conduction of AlN is several times efficacious than the other ceramics. Hence, it is widely used for the heat dissipation. On the other hand, the green technology of composite with phase change materials(PCM) is worked as a constant temperature cooler. PCMs show, great potential for saving energy and green environment. As a result, it is worth noting in heat dissipation for the pair of copper and AlN film with PCM. However, the properties of this material pair are quite complex. It is necessary to analyze further theoretically and experimentally about its reliability and the feasibility.
Based on the above statements, the thermal contact resistance of copper and AlN film with PCM were dynamically measured in this paper. The heat conduction property for this pair can thus be investigated. The variations of electrical contact resistance and friction coefficient with time were evaluated by a reciprocating wear tester inorder to set up. The tribological properties of such PCM-Composited pair can be experimentally studied deeply.
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