The Optimization of Photolithography in Wafer Level packaging
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 104 === Wafer level passive components are attracted much attention due to the development of semiconductor processing techniques and the demand of 3C electronic packages becomes thinner and lighter. This thesis focus on the study of the processing par...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/29954611153148074799 |