Pre-Bond TSV Test Enabled by Ring Oscillators
碩士 === 淡江大學 === 電機工程學系碩士班 === 104 === The popularity of 3D-IC is rising among industry and research groups. 3D-IC is based on Through Silicon Via (TSVs), which are emerging as one of the main competitors to continue the trend of Moore’s Law. We use ring oscillators to test TSV errors, and build some...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02165578263799258669 |