| Summary: | 碩士 === 明新科技大學 === 工業工程與管理系碩士班 === 105 === In the study, the standards of the ISO 14040/14044 and Product Environmental Footprint Guide published by EC were applied to investigate the required principles and methods for assessing the environmental footprint (EF) of printed circuit boards (PCB). The EF of PCB was obtained based on the relevant standards. The scenario analysis was conducted to seek the potentials of environmental performance improvement. A real PCB company located in Taoyuan City was examined as a case study, and one of PCB products manufactured (i.e., handheld communication PCB) was selected as the target product to assess the EF of PCB. The system boundary was “cradle to gate,” denoting that EF quantification must include the life cycle of the products from raw material acquisition to production. The unit of analysis was “a box of PCBs (containing 10 pieces of PCBs)”. The results of the study indicate that the impact categories that their normalised EF of PCB were ranked the top four were resource depletion-water (RDW), photochemical ozone formation (POF), ionising radiations-human health effects (IRHHE), and climate change (CC). Overall, for the four impact categories (i.e., RDW, POF, IRHHE, and CC), the ratio of the EF of PCB in the manufacturing stage is bigger than that in the raw material acquisition stage, and water and electricity have had the most impact in the manufacturing stage. Based on the results of the EF of PCB (called base scenario), this study proposed an improvement scenario which assumed that the conventional lighting in the factory was upgraded to thermal infrared remote sensing LED lighting and it could reduce electricity use by 8.3%. The results indicate that the EF of PCB in the improvement scenario was reduced when compared with the EF in the base scenario.
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