Effects of Copper Brighteners on Throwing Power and Thermal Reliability of Plating Through Holes
碩士 === 國立中興大學 === 化學工程學系所 === 105 === High aspect ratio through holes are commonly designed in printed circuit boards (PCBs) with a high density interconnection. In this study, the PCB sample are metalized by Cu electroless deposition and then by Cu electroplating. When electroplating, adding three...
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2016
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| Online Access: | http://ndltd.ncl.edu.tw/handle/31020227311338658064 |