Intelligent Predictive PID Temperature Control for Transfer Mold Machines in Semiconductor Die Packaging
碩士 === 國立中興大學 === 電機工程學系所 === 105 === This thesis develops methodologies and techniques for design and implementation of two intelligent predictive temperature controllers for the heat mold of transfer mold machines in semiconductor die packaging. The heat mold is operated in two control modes: one...
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| Format: | Others |
| Language: | en_US |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/ubm5yf |