Surface Contamination Removal from the Side-wall of Nano-probe Using Wet Cleaning with Megasonic Waves

• Main Authors: Kenneth Tseng, 鄭智遠
• Other Authors: Shyong Lee
• Format: Others
• Language: zh-TW
• Published: 2016
• Online Access: http://ndltd.ncl.edu.tw/handle/bt3cra

碩士 === 國立中央大學 === 機械工程學系 === 105 === Megasonic cleaning is possible to clean the nano-size particles without destroying the wafer surface characteristics. Therefore, cleaning the nano-size of the nano-probe must use to megasonic assist in cleaning. Wet cleaning RCA SC-1 has excellent removal efficiency of particulate contamination but it can cause wafer micro-etching and surface roughness which affect subsequent use. Using megasonic assists RCA SC-1 cleaning strengthens the uniformity of solution cleaning, quickly cleans the wafer surface, makes the surface not so rough after the clean, strengthens the clean after cleaning, and without causing damage to the surface. In this study, different sizes of nano-probes were prepared for RCA SC-1 cleaning. Respectively, the width of about 100nm、200nm and 300nm. Aspect ratio of about 1.5:1. Using an optical microscope to observe whether the clean before and after the experiment. SEM was used to observe whether the micro-particles attached to the nano-probe, the surface roughness, and the etching of the nano-probe by RCA SC-1.