Electroless Copper Deposition on Silane Modified IC Substrate

• Main Authors: Chang, Ching-Jui, 章景睿
• Other Authors: Wei, Tzu-Chien
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/q5txsc

碩士 === 國立清華大學 === 化學工程學系所 === 105 === Traditional electroless copper deposition technology cannot satisfy the requirement of fine linewidth and minimal signal loss, which are the features of advanced circuitry. To meet the feature of fine linewidth and minimal signal loss of advanced circuit, modern substrates are made flat and does not allow massively roughened. In this study, we aim to modify the surface of Ajinomoto Build-up Film (ABF) by the formation of the covalent bond between silane, 3-2-(2-amionethylamino) ethylamino propyl trimethoxysilane (ETAS) and substrate. After ETAS modification, home-made polyvinyl alcohol capped palladium(PVA-Pd) nanoparticles were adsorbed onto ETAS-modified ABF film to catalyze electroless copper plating. To enhance the adhesion by interaction of ETAS with PVA-Pd. In the first part of this study, we analyze the effect of ETAS modification on ABF GX-T37 by water contact angle, atomic force microscope (AFM) and X-ray photoelectron spectroscopy (XPS). Meanwhile, the adhesion of electroless copper layers prepared using commercial catalyst (Sn/Pd and Pd-ion) were compared. Finally, the relationship between ETAS modification and the adhesion has been connected. Although repeating the adhesion tests, the result show low reproducibility between the ABF GX-T37substrates fabricated by different lots. Therefore, the following analysis of morphology of substrate was carried out to clarify the effect of desmear process on adhesion. In the second part of this study, we focused on the morphological features of different types of ABF substrate after desmear process using scanning electron microscope (SEM) and Energy-Dispersive Spectroscopy (EDS) and AFM. Moreover, we scrutinized the profile at copper/substrate interface. Finally, we found out the major factor on influencing adhesion between electroless copper layer and ABF substrate. Furthermore, we are looking forward to apply this technic into the commercialized ABF GX-13 substrate.