Investigation of Encapsulation Structures for Flexible Organic Light-Emitting Displays

• Main Authors: Zhen Hua Tsai, 蔡振華
• Other Authors: 武東星
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/vk6rcw

碩士 === 國立中興大學 === 材料科學與工程學系所 === 106 === Organic light-emitting diodes (OLEDs) are solid-state lighting devices that emit light through the combination of holes and electrons in a junction region. Recently, OLEDs are most commonly used in displays and lighting applications. In comparison to other displays, OLED displays possess several advantages such as high brightness, wide viewing angle, self-luminous property, high contrast, microsecond response time, wide operating temperature range (-40~70 C), and ultra-thin thickness. In this research, to develop the flexible OLED panel technology, the traditional glass substrate was replaced with the polyimide (PI) substrate, and a plastic substrate with the moisture barrier capability was used as the back-plate. Moreover, the face-sealing encapsulation method was adopted for the OLED package to overcome some problems consisting of ITO crack and stress pulling. Various OLED device structures have been presented in this study. Especially, the filler and solid getter were both employed as the buffer layers between OLED and back-plate. In comparison to the expensive thin-film packaging process, the packaging method proposed in this thesis is more cost-effective. Based on the measured results, the OLED with the D-1 packaging structure possesses the optimum device performances, where its lifetimes for T50 (shrinkage) and T55 (luminous decay) tests were estimated to be 27576 and 29989 hours, respectively.