A Study on the Effect of Different Heat Sources on Cleanroom Fan Filter Unit Distribution by Using Computational Fluid Dynamics

• Main Authors: Kuan-WeiChiu, 邱冠瑋
• Other Authors: Heiu-Jou Shaw
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/z4zze4

碩士 === 國立成功大學 === 工程管理碩士在職專班 === 106 === In the semiconductor factory buildings, all kinds of clean rooms of different cleanliness grades were set. At present, the cleanliness level and the air conditioning design are generally based on the definition in the United States Federal Standard (FS-209) specification, among which the clean room with cleanliness of Class-100 is the most extensive design. Therefore, the current domestic plant usually install FFU(Fan Filter Unit) over to a ceiling of 25% coverage of the area to meet the demand for air conditioning Class-100, but the number of FFUs had became a huge initial costs and operating costs of the plant ,continuing to reduce the coverage of FFUs is still an ongoing task for the industry. However, how to verify its effect on the clean room environment after reducing the coverage of the FFUs was the goal of our research. This study will use the computational fluid dynamics software (STAR-CCM +) to different coverage of FFUs for partial space in physical plants to investigate the effect of changes to reduce coverage of FFUs configured for the clean room ambient temperature, air velocity vector; Therefore, we first discuss the optimal design model after reducing the coverage to 20%, and then use the two different coverage ratios of 25% and 20% to match the characteristics of the heat source of three different tools. The model simulates the temperature and flow field distribution , and analyzes the effects of different FFU designs on the flow field and temperature variation on the standard height plane of the clean room. Finally, we got the effect of the heat source by the simulation on the tool, under the conditions of high power heat losses such as 1050W, which could not meet the temperature control requirements of the standard height plane of 22±4 °C, but the power loss of the tool became heat source under 800W , FFUs could be reduced coverage to 20% with the ideal distribution while meeting the conditions of 22±4 °C, which can effectively reduce the initial costs and operating energy consumption of the semiconductor industry by about 20%.