Electrodeposition of CuMn Films in Non-aqueous Solution
碩士 === 國立交通大學 === 材料科學與工程學系奈米科技碩博士班 === 106 === The feature size of integrated circuit is constantly miniaturized as predicted by Moore’s law. As the wire dimension was reduced to less than 0.18 µm, aluminum wire was replaced by copper which exhibits higher conductivity and reduced RC delay. However...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/bj5y79 |