Analysis and Numerical Modeling of Hot Air Recirculation in Data Center

• Main Authors: Chen, Li-Wei, 陳立偉
• Other Authors: Tsui, Yeng-Yung
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/2h5mu5

碩士 === 國立交通大學 === 機械工程系所 === 106 === In this study, numerical simulation is used to analyze and improve the phenomenon in hot air recirculation and overheating rack in a small-scaled data center with overheat supply system, two dimensionless parameters such as rack cooling index (RCI) and supply heat index (SHI) are used to evaluate the phenomenon in hot air recirculation and overheating rack in data center. Variables such as fan flow rate, CRAH temperature, distribution of total power in each rack, distribution of total power in each part of rack, the placement of return air vent, the position of supply air vent, installation of partition are changed in this study. The results indicate that when the fan flow rate is less than supply flow rate, the RCI increases to 60.4％. With respect to CRAH temperature, the RCI increases to 65.4％ while reducing the CRAH temperature to 20℃. When the return air vent is placed in lower position, the RCI increases to 51.3％. By changing the total power of racks, when the total power on both side of racks is reduced, the RCI increases to 60.4％. When place higher power part at the bottom of the racks, the RCI increases to 60％. In terms of air supply configuration, when the supply air vents from 1-6 are opened, the RCI increases to 56.7％. By virtue of installing full containments at cold aisle will increase RCI to 100%. Due to completely block by partitions, the hot air can rarely recirculate back to racks.