Effects of DK and PIM by Printed Circuit Board Material Section on Printed Circuit Board Antenna

• Main Authors: Tsung-Ta Wu, 吳棕達
• Other Authors: Jia-Chin Lin
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/w4c45n

碩士 === 國立中央大學 === 通訊工程學系在職專班 === 106 === This paper investigates the material select for Printed Circuit Board and how do the Dielectric Constant and PIM influence on the antennas of Printed Circuit Board. There are four parts in this paper. First, we focus on the design, use, process architecture, stacking of Printed Circuit Board and the reliability testing and electronic testing of Printed Circuit Board. Second, we focus on Dielectric Constant, then provide high-frequency material suggestion base on Dielectric Constant value, Dielectric loss, thermal expansion coefficient and thermal conductivity. Third, selected based on passive intermodulation (PIM) as a reference for Printed Circuit Board antenna. Fourth, taking the Dielectric Constant layer corresponding to different antenna patch sizes as an experiment, Provides verification through passive intermodulation strategies and different materials subject to passive intermodulation interference, summarizes the reference for circuit board material manufacturing. The results show that the combination of thicker circuit materials and low Dielectric Constant is more advantageous for antenna radiation design, but it is more disadvantageous for feeders. Passive intermodulation interference might cause problems for printed circuit board antennas. It affects the distance and frequency of different antennas. Passive intermodulation requires only a very low level of energy to cause problems in these technologies. Passive intermodulation interference is mainly Sensitivity resulting in a passive intermodulation value of -150dBc is a good range of cognitive products