Development of Bidirectional Electrode in Electro-Kinetic Force Assisted Chemical Mechanical Planarization for Through-Silicon-Via Wafer Planarization
碩士 === 國立臺灣科技大學 === 機械工程系 === 106 === This study aims to design a bi-directional electrode for developing a novel Electro-Kinetic Force Chemical Mechanical Polishing/Planarization (EKF-CMP) for Cu-CMP and glass wafer CMP. Currently CMP is one of the major processes in the fabrication of Integrated C...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/mehw9f |