Research on semiconductor wire bonding process of heat block tooling
碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 106 === Research on semiconductor of QFN and QFP product structure in IC assembly. Heat block is wire bonding process assisted tooling in IC assembly. Purpose is prevention of ball lifting, finger bonding fail, loop height issue, ball forming issue, etc. W...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/656gzb |