Film Over Wire For Thin Of Stacked Die Device Study
碩士 === 國立高雄科技大學 === 化學工程與材料工程系 === 107 === In the past, stacked chip scale package (SCSP) of die and die between with spacer to support, so that the wires are not limit by the stack. However, the trend of electronic development is thinning and improved performance. In this study, we will explore the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/p3b8fy |