Ultrasonic Bonding of Ag-4Pd Alloy and Pure Cu Ribbons on Various Substrates
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 107 === With the development of green energy industry and electric car, the electric package technology of high power module must process high reliability and high heat dissipation. In recent years, Silver-Palladium Alloy material has been developed to alternate the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4tabup |