Analysis on Performance Index of Fine Polishing Pad for Copper CMP Process
碩士 === 國立臺灣科技大學 === 機械工程系 === 107 === Semiconductor devices recently are consistently heading to achieve higher resolution due to copper wires interconnect in back end of line(BEOL), Chemical Mechanical Polishing/Planarization(CMP) continues to face many challenges to fulfill such demands. The CMP p...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/c2u99h |