Study on Simulation of Dressing Locus of Multiple Diamonds on Soft and Ductile Polyurethane Pad
碩士 === 國立臺灣科技大學 === 機械工程系 === 107 === Chemical Mechanical Planarization/Polishing (CMP) process plays an important role in IC fabrication quality control in whole semiconductor fabrication. In order to maintain the yield rate of wafer in CMP process, the diamond dressing technique has been applied f...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7jmx7w |