3D-IC Technology Characterization and Test Chip Design
With sub-micron silicon processing technology reaching under 30nm, it becomes more difficult for integrated circuits to achieve higher integration through the scaling down of the transistor size. Three-dimensional integrated circuit (3D-IC) technology stacks multiple dies together and connects the...
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| Language: | English |
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2013
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| Online Access: | http://hdl.handle.net/10388/ETD-2013-02-912 |